Features

• UL
• TE Connectivity Substrate-Mounted Signal Relay - IM Series
• IM Series Thin Substrate-Mounted Signal Relay has a low profile with a height of 5.65 mm and occupies a minimal substrate space of 60 mm2.　The IM series thin substrate mounted signal relay has low power consumption coils of 140 mW (standard coil), 100 mW (bi-table), and 50 mW (ultra-sensitive type), high insulation surge capability, and mechanical shock resistance of 300 g.
• Features and Advantages: Thin and Low Profile -10 x 6 x 5.65 mm Branched Contact, Gold Plated Hermetic Shield (RT V), IP67 High Mechanical Impact Resistance up to 300 G (Functional) and 500 G (Remaining) Insulation Resistance @ 500 V dc > 10 Ω Excellent Surge Voltage (1.2/50 μs and 10/700 μs) Compliant with Telcordia GR 1089, FCC Part 68, and ITU-T K20, 21, and 45 1500 V Between Open Contact, 2500 V Between Coil and Contact
• Application:
• Communication Equipment Optics Network Terminals Office Equipment Instruments Medical Equipment On-Vehicle Application