Features

• Uses measuring device which measures changes in thin metal film over chip ca***d by heat applied to measuring chip as optical reflectance and quantifies temperature profile. （※ Temperature profile: temperature x time, ***s change in thin AI film ca***d by heat.）
• Suitable for measurement of thermal status inside sealed container heat and multipoint temperature distribution measurement in furnace.
• Measures temperature distribution with high degree of accuracy if ***d with thermocouple.